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1. Robust Avalanche in 1.7 kV Vertical GaN Diodes with a Single-Implant Bevel Edge Termination

   https://doi.org/10.1109/LED.2023.3302312  

   Xiao, Ming; Wang, Yifan; Zhang, Ruizhe; Song, Qihao; Porter, Matthew; Carlson, Eric; Cheng, Kai; Ngo, Khai; Zhang, Yuhao (January 2023, IEEE Electron Device Letters)

   This work demonstrates a novel junction termination extension (JTE) with a graded charge profile for vertical GaN p-n diodes. The fabrication of this JTE obviates GaN etch and requires only a single-step implantation. A bi-layer photoresist is used to produce an ultra-small bevel angle (~0.1°) at the sidewall of a dielectric layer. This tapered dielectric layer is then used as the implantation mask to produce a graded charge profile in p-GaN. The fabricated GaN p-n diodes show a breakdown voltage ( BV ) of 1.7 kV (83% of the parallel-plane limit) with positive temperature coefficient, as well as a high avalanche current density over 1100 A/cm 2 at BV in the unclamped inductive switching test. This robust avalanche is ascribed to the migration of the major impact ionization location from the JTE edge to the main junction. This single-implant, efficient, avalanche-capable JTE can potentially become a building block of many vertical GaN devices, and its fabrication technique has wide device and material applicability. 

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2. Ensemble GaAsSb/GaAs axial configured nanowire-based separate absorption, charge, and multiplication avalanche near-infrared photodetectors

   https://doi.org/10.1039/D2NA00359G  

   Parakh, M.; Pokharel, R.; Dawkins, K.; Devkota, S.; Li, J.; Iyer, S. (January 2022, Nanoscale Advances)

   In this study, molecular beam epitaxially grown axially configured ensemble GaAsSb/GaAs separate absorption, charge, and multiplication (SACM) region-based nanowire avalanche photodetector device on non-patterned Si substrate is presented. Our device exhibits a low breakdown voltage ( V BR ) of ∼ −10 ± 2.5 V under dark, photocurrent gain ( M ) varying from 20 in linear mode to avalanche gain of 700 at V BR at a 1.064 μm wavelength. Positive temperature dependence of breakdown voltage ∼ 12.6 mV K −1 further affirms avalanche breakdown as the gain mechanism in our SACM NW APDs. Capacitance–voltage ( C – V ) and temperature-dependent noise characteristics also validated punch-through voltage ascertained from I – V measurements, and avalanche being the dominant gain mechanism in the APDs. The ensemble SACM NW APD device demonstrated a broad spectral room temperature response with a cut-off wavelength of ∼1.2 μm with a responsivity of ∼0.17–0.38 A W −1 at −3 V. This work offers a potential pathway toward realizing tunable nanowire-based avalanche photodetectors compatible with traditional Si technology. 

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3. Vertical GaN Fin JFET: A Power Device with Short Circuit Robustness at Avalanche Breakdown Voltage

   https://doi.org/10.1109/IRPS48227.2022.9764569  

   Zhang, R.; Liu, J.; Li, Q.; Pidaparthi, S.; Edwards, A.; Drowley, C.; Zhang, Y. (March 2022, Vertical GaN Fin JFET: A Power Device with Short Circuit Robustness at Avalanche Breakdown Voltage)

   GaN high-electron-mobility transistors (HEMTs) are known to have no avalanche capability and insufficient short-circuit robustness. Recently, breakthrough avalanche and short-circuit capabilities have been experimentally demonstrated in a vertical GaN fin-channel junction-gate field-effect transistor (Fin-JFET), which shows a good promise for using GaN devices in automotive powertrains and electric grids. In particular, GaN Fin-JFETs demonstrated good short-circuit capability at avalanche breakdown voltage (BV AVA ), with a failure-to-open-circuit (FTO) signature. This work presents a comprehensive device physics-based study of the GaN Fin-JFET under short-circuit conditions, particularly at a bus voltage close to BV AVA . Mixed-mode electrothermal TCAD simulations were performed to understand the carrier dynamics, electric field distributions, and temperature profiles in the Fin-JFET under short-circuit and avalanche conditions. The results provide important physical references to understand the unique robustness of the vertical GaN Fin-JFET under the concurrence of short-circuit and avalanche as well as its desirable FTO signature. 

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4. Impact of Residual Carbon on Avalanche Voltage and Stability of Polarization-Induced Vertical GaN p-n Junction

   Elena Fabris, Carlo De (January 2020, IEEE transactions on electron devices)

   null (Ed.)

   We demonstrate that the residual carbon concentration in the drift region can have a significant impact on the reverse leakage, breakdown voltage, and breakdown stability of GaN-on-GaN vertical diodes. Two generations (Gen1, Gen2) of polarization-doped p-n junctions with different C concentrations were compared, in terms of avalanche voltage, avalanche instability, and deep-level concentration. The original results collected within this paper show that: 1) both generations of devices can safely reach the avalanche regime; diodes with a lower residual CN have a higher reverse leakage and a lower avalanche voltage, due to an uneven distribution of the electric field; 2) the presence of residual carbon can lead to breakdown walkout, i.e. a recoverable increase in breakdown voltage under reverse-bias stress. Specifically, devices with higher C concentration show a fully-recoverable breakdown walk-out, whereas the breakdown voltage is stable in devices with lowerC concentration;and 3) steady-state photocapacitance measurements confirm the presence of CN in both generations, and are used to assess the relative difference in concentration between Gen1 and Gen2, even for levels below secondary ion mass spectroscopy (SIMS) sensitivity. The results described in this paper indicate the existence of a trade-off between breakdown voltage (increasing by improving compensation) and breakdown stability (improving by reducing CN concentration) and are of fundamental importance for the optimization of GaN power devices. 

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5. (Invited) Breakthrough Avalanche and Short Circuit Robustness in Vertical GaN Power Devices

   https://doi.org/10.1149/10806.0011ecst  

   Zhang, Yuhao; Zhang, Ruizhe; Song, Qihao; Li, Qiang; Liu, J. (May 2022, ECS Transactions)

   Power devices are highly desirable to possess excellent avalanche and short-circuit (or surge-current) robustness for numerous power electronics applications like automotive powertrains, electric grids, motor drives, among many others. Current commercial GaN power device, the lateral GaN high-electron-mobility transistor (HEMT), is known to have no avalanche capability and very limited short-circuit robustness. These limitations have become a roadblock for penetration of GaN devices in many industrial power applications. Recently, through collaborations with NexGen Power Systems (NexGen), Inc., we have demonstrated breakthrough avalanche, surge-current and short-circuit robustness in NexGen’s vertical GaN p-n diodes and fin-shape junction-gate field-effect-transistors (Fin-JFETs). These large-area GaN diodes and Fin-JFETs were manufactured in NexGen’s 100 mm GaN-on-GaN fab. The demonstrated avalanche, surge-current and short-circuit capabilities are comparable or even superior to Si and SiC power devices. Additionally, vertical GaN Fin-JFETs were found to fail to open-circuit under avalanche and short-circuit conditions, which is highly desirable for the system safety. This talk reviews the key robustness results of vertical GaN power devices and unveils the enabling device physics. Fundamentally, these results signify that, in contrast to some popular belief, GaN devices with appropriate designs can achieve excellent robustness and thereby encounter no barriers for applications in electric vehicles, grids, renewable processing, and industrial motor drives. 

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