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Abstract Gallium‐based liquid metal (LM) composite with metallic fillers is an emerging class of thermal interface materials (TIMs), which are widely applied in electronics and power systems to improve their performance. In situ alloying between gallium and many metallic fillers like copper and silver, however, leads to a deteriorated composite stability. This paper presents an interfacial engineering approach using 3‐chloropropyltriethoxysilane (CPTES) to serve as effective thermal linkers and diffusion barriers at the copper‐gallium oxide interfaces in the LM matrix, achieving an enhancement in both thermal conductivity and stability of the composite. By mixing LM with copper particles modified by CPTES, a thermal conductivity (κ) as high as 65.9 W m−1K−1is achieved. In addition, κ can be tuned by altering the terminal groups of silane molecules, demonstrating the flexibility of this approach. The potential use of such composite as a TIM is also shown in the heat dissipation of a computer central processing unit. While most studies on LM‐based composites enhance the material performance via direct mixing of various fillers, this work provides a different approach to fabricate high‐performance LM‐based composites and may further advance their applications in various areas including thermal management systems, flexible electronics, consumer electronics, and biomedical systems.
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Surface Photon‐Engineered Infrared‐Black Metametal Enabled Enhancement of Heat Dissipation
Abstract Heat dissipation is a severe barrier for ever‐smaller and more functionalized electronics, necessitating the continuous development of accessible, cost‐effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (<0.03) severely restricts their radiative heat dissipation capability. Here, a solution‐processed chemical oxidation reaction is demonstrated for transfiguring “infrared‐white” metals (high infrared thermal reflectance) to “infrared‐black” metametals (high infrared thermal emittance). Enabled by strong molecular vibrations of metal‐oxygen chemical bonds, this strategy via assembling nanostructured metal oxide thin films on metal surface yields infrared spectrum manipulation, high and omnidirectional thermal emittance (0.94 from 0 to 60°) with excellent thermomechanical stability. The thin film of metal oxides with relatively high thermal conductivity does not hinder heat dissipation. “Infrared‐black” meta‐aluminum shows a temperature drop of 21.3 °C corresponding to a cooling efficiency of 17.2% enhancement than the pristine aluminum alloy under a heating power of 2418 W m−2. This surface photon‐engineered strategy is compatible with other metals, such as copper and steel, and it broadens its implementation for accelerating heat dissipation.
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- Award ID(s):
- 1941743
- PAR ID:
- 10380549
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Functional Materials
- Volume:
- 32
- Issue:
- 46
- ISSN:
- 1616-301X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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