skip to main content

Title: Comparing the thermal performance and endurance of resistive and PIN silicon microheaters for phase-change photonic applications

Optical phase-change materials have enabled nonvolatile programmability in integrated photonic circuits by leveraging a reversible phase transition between amorphous and crystalline states. To control these materials in a scalable manner on-chip, heating the waveguide itself via electrical currents is an attractive option which has been recently explored using various approaches. Here, we compare the heating efficiency, fabrication variability, and endurance of two promising heater designs which can be easily integrated into silicon waveguides—a resistive microheater using n-doped silicon and one using a silicon p-type/intrinsic/n-type (PIN) junction. Raman thermometry is used to characterize the heating efficiencies of these microheaters, showing that both devices can achieve similar peak temperatures but revealing damage in the PIN devices. Subsequent endurance testing and characterization of both device types provide further insights into the reliability and potential damage mechanisms that can arise in electrically programmable phase-change photonic devices.

Authors:
; ; ; ; ; ; ; ; ;
Award ID(s):
2028624 2210169
Publication Date:
NSF-PAR ID:
10414157
Journal Name:
Optical Materials Express
Volume:
13
Issue:
6
Page Range or eLocation-ID:
Article No. 1677
ISSN:
2159-3930
Publisher:
Optical Society of America
Sponsoring Org:
National Science Foundation
More Like this
  1. Abstract

    Reconfigurability of photonic integrated circuits (PICs) has become increasingly important due to the growing demands for electronic–photonic systems on a chip driven by emerging applications, including neuromorphic computing, quantum information, and microwave photonics. Success in these fields usually requires highly scalable photonic switching units as essential building blocks. Current photonic switches, however, mainly rely on materials with weak, volatile thermo‐optic or electro‐optic modulation effects, resulting in large footprints and high energy consumption. As a promising alternative, chalcogenide phase‐change materials (PCMs) exhibit strong optical modulation in a static, self‐holding fashion, but the scalability of present PCM‐integrated photonic applications is still limited by the poor optical or electrical actuation approaches. Here, with phase transitions actuated by in situ silicon PIN diode heaters, scalable nonvolatile electrically reconfigurable photonic switches using PCM‐clad silicon waveguides and microring resonators are demonstrated. As a result, intrinsically compact and energy‐efficient switching units operated with low driving voltages, near‐zero additional loss, and reversible switching with high endurance are obtained in a complementary metal‐oxide‐semiconductor (CMOS)‐compatible process. This work can potentially enable very large‐scale CMOS‐integrated programmable electronic–photonic systems such as optical neural networks and general‐purpose integrated photonic processors.

  2. Two dimensional (2D) materials such as graphene and transition metal dichalcogenides (TMDs) are promising for optical modulation, detection, and light emission since their material properties can be tuned on-demand via electrostatic doping1–21. The optical properties of TMDs have been shown to change drastically with doping in the wavelength range near the excitonic resonances22–26. However, little is known about the effect of doping on the optical properties of TMDs away from these resonances, where the material is transparent and therefore could be leveraged in photonic circuits. Here, we probe the electro-optic response of monolayer TMDs at near infrared (NIR) wavelengths (i.e. deep in the transparency regime), by integrating them on silicon nitride (SiN) photonic structures to induce strong light -matter interaction with the monolayer. We dope the monolayer to carrier densities of (7.2 ± 0.8) × 1013 cm-2, by electrically gating the TMD using an ionic liquid [P14+] [FAP-]. We show strong electro-refractive response in monolayer tungsten disulphide (WS2) at NIR wavelengths by measuring a large change in the real part of refractive index ∆n = 0.53, with only a minimal change in the imaginary part ∆k = 0.004. We demonstrate photonic devices based on electrostatically gated SiN-WS2 phase modulator withmore »high efficiency ( ) of 0.8 V · cm. We show that the induced phase change relative to the change in absorption (i.e. ∆n/∆k) is approximately 125, that is significantly higher than the ones achieved in 2D materials at different spectral ranges and in bulk materials, commonly employed for silicon photonic modulators such as Si and III-V on Si, while accompanied by negligible insertion loss. Efficient phase modulators are critical for enabling large-scale photonic systems for applications such as Light Detection and Ranging (LIDAR), phased arrays, optical switching, coherent optical communication and quantum and optical neural networks27–30.« less
  3. Abstract

    Phase change materials (PCMs) have long been used as a storage medium in rewritable compact disk and later in random access memory. In recent years, integration of PCMs with nanophotonic structures has introduced a new paradigm for non‐volatile reconfigurable optics. However, the high loss of the archetypal PCM Ge2Sb2Te5in both visible and telecommunication wavelengths has fundamentally limited its applications. Sb2S3has recently emerged as a wide‐bandgap PCM with transparency windows ranging from 610 nm to near‐IR. In this paper, the strong optical phase modulation and low optical loss of Sb2S3are experimentally demonstrated for the first time in integrated photonic platforms at both 750 and 1550 nm. As opposed to silicon, the thermo‐optic coefficient of Sb2S3is shown to be negative, making the Sb2S3–Si hybrid platform less sensitive to thermal fluctuation. Finally, a Sb2S3integrated non‐volatile microring switch is demonstrated which can be tuned electrically between a high and low transmission state with a contrast over 30 dB. This work experimentally verifies prominent phase modification and low loss of Sb2S3in wavelength ranges relevant for both solid‐state quantum emitter and telecommunication, enabling potential applications such as optical field programmable gate array, post‐fabrication trimming, and large‐scale integrated quantum photonic network.

  4. García-Blanco, Sonia M. ; Cheben, Pavel (Ed.)
    The benefits of photonics over electronics in the application of optical transceivers and both classical and quantum computing have been demonstrated over the past decades, especially in the ability to achieve high bandwidth, high interconnectivity, and low latency. Due to the high maturity of silicon photonics foundries, research on photonics devices such as silicon micro ring resonators (MRRs), Mach-Zehnder modulators (MZM), and photonic crystal (PC) resonators has attracted plenty of attention. Among these photonic devices, silicon MRRs using carrier depletion effects in p-n junctions represent optical switches manufacturable in the most compact magnitude at high volume with demonstrated switching energies ~5.2fJ/bit. In matrix multiplication demonstrated with integrated photonics, one approach is to couple one bus straight waveguide to several MRRs with different resonant wavelengths to transport signals in different channels, corresponding to a matrix row or column. However, such architectures are potentially limited to ~30 MRRs in series, by the limited free-spectral range (FSR) of an individual MRR. We show that PC switches with sub-micron optical mode confinements can have a FSR >300nm, which can potentially enable energy efficient computing with larger matrices of ~200 resonators by multiplexing. In this paper, we present designs for an oxide-clad bus-coupled PC switchmore »with 1dB insertion loss, 5dB extinction, and ~260aJ/bit switching energy by careful control of the cavity geometry as well as p-n junction doping. We also demonstrate that air-clad bus-coupled PC switches can operate with 1dB insertion loss, 3dB extinction, and ~80aJ/bit switching energy.« less
  5. Resonant tunneling diodes (RTDs) have come full-circle in the past 10 years after their demonstration in the early 1990s as the fastest room-temperature semiconductor oscillator, displaying experimental results up to 712 GHz and fmax values exceeding 1.0 THz [1]. Now the RTD is once again the preeminent electronic oscillator above 1.0 THz and is being implemented as a coherent source [2] and a self-oscillating mixer [3], amongst other applications. This paper concerns RTD electroluminescence – an effect that has been studied very little in the past 30+ years of RTD development, and not at room temperature. We present experiments and modeling of an n-type In0.53Ga0.47As/AlAs double-barrier RTD operating as a cross-gap light emitter at ~300K. The MBE-growth stack is shown in Fig. 1(a). A 15-μm-diam-mesa device was defined by standard planar processing including a top annular ohmic contact with a 5-μm-diam pinhole in the center to couple out enough of the internal emission for accurate free-space power measurements [4]. The emission spectra have the behavior displayed in Fig. 1(b), parameterized by bias voltage (VB). The long wavelength emission edge is at  = 1684 nm - close to the In0.53Ga0.47As bandgap energy of Ug ≈ 0.75 eV at 300 K.more »The spectral peaks for VB = 2.8 and 3.0 V both occur around  = 1550 nm (h = 0.75 eV), so blue-shifted relative to the peak of the “ideal”, bulk InGaAs emission spectrum shown in Fig. 1(b) [5]. These results are consistent with the model displayed in Fig. 1(c), whereby the broad emission peak is attributed to the radiative recombination between electrons accumulated on the emitter side, and holes generated on the emitter side by interband tunneling with current density Jinter. The blue-shifted main peak is attributed to the quantum-size effect on the emitter side, which creates a radiative recombination rate RN,2 comparable to the band-edge cross-gap rate RN,1. Further support for this model is provided by the shorter wavelength and weaker emission peak shown in Fig. 1(b) around = 1148 nm. Our quantum mechanical calculations attribute this to radiative recombination RR,3 in the RTD quantum well between the electron ground-state level E1,e, and the hole level E1,h. To further test the model and estimate quantum efficiencies, we conducted optical power measurements using a large-area Ge photodiode located ≈3 mm away from the RTD pinhole, and having spectral response between 800 and 1800 nm with a peak responsivity of ≈0.85 A/W at  =1550 nm. Simultaneous I-V and L-V plots were obtained and are plotted in Fig. 2(a) with positive bias on the top contact (emitter on the bottom). The I-V curve displays a pronounced NDR region having a current peak-to-valley current ratio of 10.7 (typical for In0.53Ga0.47As RTDs). The external quantum efficiency (EQE) was calculated from EQE = e∙IP/(∙IE∙h) where IP is the photodiode dc current and IE the RTD current. The plot of EQE is shown in Fig. 2(b) where we see a very rapid rise with VB, but a maximum value (at VB= 3.0 V) of only ≈2×10-5. To extract the internal quantum efficiency (IQE), we use the expression EQE= c ∙i ∙r ≡ c∙IQE where ci, and r are the optical-coupling, electrical-injection, and radiative recombination efficiencies, respectively [6]. Our separate optical calculations yield c≈3.4×10-4 (limited primarily by the small pinhole) from which we obtain the curve of IQE plotted in Fig. 2(b) (right-hand scale). The maximum value of IQE (again at VB = 3.0 V) is 6.0%. From the implicit definition of IQE in terms of i and r given above, and the fact that the recombination efficiency in In0.53Ga0.47As is likely limited by Auger scattering, this result for IQE suggests that i might be significantly high. To estimate i, we have used the experimental total current of Fig. 2(a), the Kane two-band model of interband tunneling [7] computed in conjunction with a solution to Poisson’s equation across the entire structure, and a rate-equation model of Auger recombination on the emitter side [6] assuming a free-electron density of 2×1018 cm3. We focus on the high-bias regime above VB = 2.5 V of Fig. 2(a) where most of the interband tunneling should occur in the depletion region on the collector side [Jinter,2 in Fig. 1(c)]. And because of the high-quality of the InGaAs/AlAs heterostructure (very few traps or deep levels), most of the holes should reach the emitter side by some combination of drift, diffusion, and tunneling through the valence-band double barriers (Type-I offset) between InGaAs and AlAs. The computed interband current density Jinter is shown in Fig. 3(a) along with the total current density Jtot. At the maximum Jinter (at VB=3.0 V) of 7.4×102 A/cm2, we get i = Jinter/Jtot = 0.18, which is surprisingly high considering there is no p-type doping in the device. When combined with the Auger-limited r of 0.41 and c ≈ 3.4×10-4, we find a model value of IQE = 7.4% in good agreement with experiment. This leads to the model values for EQE plotted in Fig. 2(b) - also in good agreement with experiment. Finally, we address the high Jinter and consider a possible universal nature of the light-emission mechanism. Fig. 3(b) shows the tunneling probability T according to the Kane two-band model in the three materials, In0.53Ga0.47As, GaAs, and GaN, following our observation of a similar electroluminescence mechanism in GaN/AlN RTDs (due to strong polarization field of wurtzite structures) [8]. The expression is Tinter = (2/9)∙exp[(-2 ∙Ug 2 ∙me)/(2h∙P∙E)], where Ug is the bandgap energy, P is the valence-to-conduction-band momentum matrix element, and E is the electric field. Values for the highest calculated internal E fields for the InGaAs and GaN are also shown, indicating that Tinter in those structures approaches values of ~10-5. As shown, a GaAs RTD would require an internal field of ~6×105 V/cm, which is rarely realized in standard GaAs RTDs, perhaps explaining why there have been few if any reports of room-temperature electroluminescence in the GaAs devices. [1] E.R. Brown,et al., Appl. Phys. Lett., vol. 58, 2291, 1991. [5] S. Sze, Physics of Semiconductor Devices, 2nd Ed. 12.2.1 (Wiley, 1981). [2] M. Feiginov et al., Appl. Phys. Lett., 99, 233506, 2011. [6] L. Coldren, Diode Lasers and Photonic Integrated Circuits, (Wiley, 1995). [3] Y. Nishida et al., Nature Sci. Reports, 9, 18125, 2019. [7] E.O. Kane, J. of Appl. Phy 32, 83 (1961). [4] P. Fakhimi, et al., 2019 DRC Conference Digest. [8] T. Growden, et al., Nature Light: Science & Applications 7, 17150 (2018). [5] S. Sze, Physics of Semiconductor Devices, 2nd Ed. 12.2.1 (Wiley, 1981). [6] L. Coldren, Diode Lasers and Photonic Integrated Circuits, (Wiley, 1995). [7] E.O. Kane, J. of Appl. Phy 32, 83 (1961). [8] T. Growden, et al., Nature Light: Science & Applications 7, 17150 (2018).« less