skip to main content

Explore Research Products in the NSF-PAR

Title: Hybrid Si-GaAs photonic crystal cavity for lasing and bistability

The heterogeneous integration of silicon with III-V materials provides a way to overcome silicon’s limited optical properties toward a broad range of photonic applications. Hybrid modes are a promising way to integrate such heterogeneous Si/III-V devices, but it remains unclear how to utilize these modes to achieve photonic crystal cavities. Herein, using 3D finite-difference time-domain simulations, we propose a hybrid Si-GaAs photonic crystal cavity design that operates at telecom wavelengths and can be fabricated without requiring careful alignment. The hybrid cavity consists of a patterned silicon waveguide that is coupled to a wider GaAs slab featuring InAs quantum dots. We show that by changing the width of the silicon cavity waveguide, we can engineer the hybrid modes and control the degree of coupling to the active material in the GaAs slab. This provides the ability to tune the cavity quality factor while balancing the device’s optical gain and nonlinearity. With this design, we demonstrate cavity mode confinement in the GaAs slab without directly patterning it, enabling strong interaction with the embedded quantum dots for applications such as low-power-threshold lasing and optical bistability (156 nW and 18.1µW, respectively). This heterogeneous integration of an active III-V material with silicon via a hybrid cavity design suggests a promising approach for achieving on-chip light generation and low-power nonlinear platforms.

  more » « less
NSF-PAR ID:
10470577
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
Optical Society of America
Date Published:
Journal Name:
Optics Express
Volume:
31
Issue:
23
ISSN:
1094-4087; OPEXFF
Format(s):
Medium: X Size: Article No. 37574
Size(s):
["Article No. 37574"]
Sponsoring Org:
National Science Foundation
More Like this
  1. ; ; ; ( , Proceedings Volume 12020, Vertical-Cavity Surface-Emitting Lasers XXVI)
    Choquette, Kent D. ; Lei, Chun ; Graham, Luke A. (Ed.)
    A wafer-scale CMOS-compatible process for heterogeneous integration of III-V epitaxial material onto silicon for photonic device fabrication is presented. Transfer of AlGaAs-GaAs Vertical-Cavity Surface-Emitting Laser (VCSEL) epitaxial material onto silicon using a carrier wafer process and metallic bonding is used to form III-V islands which are subsequently processed into VCSELs. The transfer process begins with the bonding of III-V wafer pieces epitaxy-down on a carrier wafer using a temporary bonding material. Following substrate removal, precisely-located islands of material are formed using photolithography and dry etching. These islands are bonded onto a silicon host wafer using a thin-film non-gold metal bonding process and the transfer wafer is removed. Following the bonding of the epitaxial islands onto the silicon wafer, standard processing methods are used to form VCSELs with non-gold contacts. The removal of the GaAs substrate prior to bonding provides an improved thermal pathway which leads to a reduction in wavelength shift with output power under continuous-wave (CW) excitation. Unlike prior work in which fullyfabricated VCSELs are flip-chip bonded to silicon, all photonic device processing takes place after the epitaxial transfer process. The electrical and optical performance of heterogeneously integrated 850nm GaAs VCSELs on silicon is compared to their as-grown counterparts. The demonstrated method creates the potential for the integration of III-V photonic devices with silicon CMOS, including CMOS imaging arrays. Such devices could have use in applications ranging from 3D imaging to LiDAR. 
    more » « less
  2. ; ; ; ; ( , Optics Express)

    Modulation-based control and locking of lasers, filters and other photonic components is a ubiquitous function across many applications that span the visible to infrared (IR), including atomic, molecular and optical (AMO), quantum sciences, fiber communications, metrology, and microwave photonics. Today, modulators used to realize these control functions consist of high-power bulk-optic components for tuning, sideband modulation, and phase and frequency shifting, while providing low optical insertion loss and operation from DC to 10s of MHz. In order to reduce the size, weight and cost of these applications and improve their scalability and reliability, modulation control functions need to be implemented in a low loss, wafer-scale CMOS-compatible photonic integration platform. The silicon nitride integration platform has been successful at realizing extremely low waveguide losses across the visible to infrared and components including high performance lasers, filters, resonators, stabilization cavities, and optical frequency combs. Yet, progress towards implementing low loss, low power modulators in the silicon nitride platform, while maintaining wafer-scale process compatibility has been limited. Here we report a significant advance in integration of a piezo-electric (PZT, lead zirconate titanate) actuated micro-ring modulation in a fully-planar, wafer-scale silicon nitride platform, that maintains low optical loss (0.03 dB/cm in a 625 µm resonator) at 1550 nm, with an order of magnitude increase in bandwidth (DC - 15 MHz 3-dB and DC - 25 MHz 6-dB) and order of magnitude lower power consumption of 20 nW improvement over prior PZT modulators. The modulator provides a >14 dB extinction ratio (ER) and 7.1 million quality-factor (Q) over the entire 4 GHz tuning range, a tuning efficiency of 162 MHz/V, and delivers the linearity required for control applications with 65.1 dB·Hz2/3and 73.8 dB·Hz2/3third-order intermodulation distortion (IMD3) spurious free dynamic range (SFDR) at 1 MHz and 10 MHz respectively. We demonstrate two control applications, laser stabilization in a Pound-Drever Hall (PDH) lock loop, reducing laser frequency noise by 40 dB, and as a laser carrier tracking filter. This PZT modulator design can be extended to the visible in the ultra-low loss silicon nitride platform with minor waveguide design changes. This integration of PZT modulation in the ultra-low loss silicon nitride waveguide platform enables modulator control functions in a wide range of visible to IR applications such as atomic and molecular transition locking for cooling, trapping and probing, controllable optical frequency combs, low-power external cavity tunable lasers, quantum computers, sensors and communications, atomic clocks, and tunable ultra-low linewidth lasers and ultra-low phase noise microwave synthesizers.

     
    more » « less
  3. ; ( , Proceedings Volume 11285, Silicon Photonics XV)
    Reed, Graham T. ; Knights, Andrew P. (Ed.)
    An array of active photonic devices is fabricated in unison after a heterogeneous integration process first metal-eutectically bonds these distinct materials as a distribution onto a silicon host wafer. The patterning out of heterogeneous materials followed by the formation of all photonic devices allows for wide-area fine-alignment without the need for discrete die alignment or placement. The integration process is designed as a CMOS-compatible, scalable method for bringing together distinct III-V epitaxial structures and optical-waveguiding epitaxial structures, demonstrating the capabilities of forming a multi-chip layer of photonic materials. Integrated GaAs-based vertical light-emitting transistors (LET) are designed and fabricated as the active devices whose third electrical terminal provides an electrical interconnect and thermal dissipation path to the silicon host wafer. The performance of these devices as both electrical transistors and spontaneous-emission optical devices is compared to their monolithically-integrated counterparts to investigate improvements in device characteristics when integrated onto silicon. The fabrication methods are modified and optimized for thin-film transferred materials and are then extended to transistor laser (TL) fabrication. Passive waveguiding structures are designed and simulated for coupling light from the active devices, and their fabrication scheme is presented such that it can be similarly performed with transferred materials. Work toward the demonstration of integrated transistor lasers is shown to represent progress toward an electronic-photonic circuit network. The combination of heterogeneous integration with three-terminal photonic structures enables an elegant solution to both packaging and signal interconnect constraints for the implementation of photonic logic in silicon photonics systems. 
    more » « less
  4. ; ; ; ; ; ; ; ( , Proceedings of the SPIE)
    Chemicals are best recognized by their unique wavelength specific optical absorption signatures in the molecular fingerprint region from λ=3-15μm. In recent years, photonic devices on chips are increasingly being used for chemical and biological sensing. Silicon has been the material of choice of the photonics industry over the last decade due to its easy integration with silicon electronics as well as its optical transparency in the near-infrared telecom wavelengths. Silicon is optically transparent from 1.1 μm to 8 μm with research from several groups in the mid-IR. However, intrinsic material losses in silicon exceed 2dB/cm after λ~7μm (~0.25dB/cm at λ=6μm). In addition to the waveguiding core, an appropriate transparent cladding is also required. Available core-cladding choices such as Ge-GaAs, GaAs-AlGaAs, InGaAs-InP would need suspended membrane photonic crystal waveguide geometries. However, since the most efficient QCLs demonstrated are in the InP platform, the choice of InGaAs-InP eliminates need for wafer bonding versus other choices. The InGaAs-InP material platform can also potentially cover the entire molecular fingerprint region from λ=3-15μm. At long wavelengths, in monolithic architectures integrating lasers, detectors and passive sensor photonic components without wafer bonding, compact passive photonic integrated circuit (PIC) components are desirable to reduce expensive epi material loss in passive PIC etched areas. In this paper, we consider miniaturization of waveguide bends and polarization rotators. We experimentally demonstrate suspended membrane subwavelength waveguide bends with compact sub-50μm bend radius and compact sub-300μm long polarization rotators in the InGaAs/InP material system. Measurements are centered at λ=6.15μm for sensing ammonia 
    more » « less
  5. ; ; ; ( , Optics Letters)

    In this Letter, we have demonstrated wavelength beam combining (WBC) through hybrid integration of photonic integrated circuits (PICs) to significantly reduce the size, weight, and operation power of the laser combining system. The hybrid integration WBC includes III/V semiconductor optical amplifiers (SOAs), which provide gain, and the silicon nitride PICs, which perform as the external cavity. We first show that the arrayed waveguide grating (AWG) -based hybrid laser defines the lasing wavelength through the AWG passband. We then demonstrate that the AWG successfully forms multiple channel lasers by combining SOAs in the hybrid platform.

     
    more » « less
  • Citation Formats
  • MLA
  • APA
  • Chicago
  • BibTeX
  • Save / Share this Record
  • Send to Email