skip to main content


This content will become publicly available on November 30, 2024

Title: Heat Transfer in Gold Interfaces Capped with Thiolated Polyethylene Glycol: A Molecular Dynamics Study
Reverse nonequilibrium molecular dynamics simulations were used to study heat transport in solvated gold interfaces which have been functionalized with a low-molecular weight thiolated polyethylene glycol (PEG). The gold interfaces studied included (111), (110), and (100) facets as well as spherical nanoparticles with radii of 10 and 20 Å. The embedded atom model (EAM) and the polarizable density-readjusted embedded atom model (DR-EAM) were implemented to determine the effect of metal polarizability on heat transport properties. We find that the interfacial thermal conductance values for thiolated PEG-capped interfaces are higher than those for pristine gold interfaces. Hydrogen bonding between the thiolated PEG and solvent differs between planar facets and the nanospheres, suggesting one mechanism for enhanced transfer of energy, while the covalent gold sulfur bond appears to create the largest barrier to thermal conduction. Through analysis of vibrational power spectra, we find an enhanced population at low-frequency heat-carrying modes for the nanospheres, which may also explain the higher mean interfacial thermal conductance (G) value.  more » « less
Award ID(s):
1954648
NSF-PAR ID:
10478635
Author(s) / Creator(s):
;
Publisher / Repository:
American Chemical Society
Date Published:
Journal Name:
The Journal of Physical Chemistry B
Volume:
127
Issue:
47
ISSN:
1520-6106
Page Range / eLocation ID:
10215 to 10225
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
More Like this
  1. The interfacial thermal conductance from solvated gold nanostructures capped with sodium citrate was determined using reverse nonequilibrium molecular dynamics (RNEMD) methods. The surfaces of spherical nanoparticles and the (111) surfaces of fcc gold slabs were modeled using the density readjusting-embedded atom method (DR-EAM) as well as with the standard embedded atom method (EAM), and the effects of polarizability on the binding preferences of citrate were determined. We find that the binding configurations of citrate depend significantly on gold surface curvature and are not strongly influenced by surface polarizability. The interfacial thermal conductance was also determined for the spherical nanoparticles and (111) surfaces, and we find that applying DR-EAM increases the interfacial thermal conductance for systems with spherical nanoparticles much more sharply than for systems with (111) surfaces. Through analysis of excess charge density near the interface, we find that inclusion of polarizability has a larger impact on image charge creation in nanospheres than it does for the planar (111) interfaces. This effectively increases the interaction strength to polar species in the solvent, yielding larger interfacial thermal conductance estimates for the nanospheres. 
    more » « less
  2. Abstract

    Heat dissipation is a major limitation of high‐performance electronics. This is especially important in emerging nanoelectronic devices consisting of ultra‐thin layers, heterostructures, and interfaces, where enhancement in thermal transport is highly desired. Here, ultra‐high interfacial thermal conductance in encapsulated van der Waals (vdW) heterostructures with single‐layer transition metal dichalcogenides MX2(MoS2, WSe2, WS2) sandwiched between two hexagonal boron nitride (hBN) layers is reported. Through Raman spectroscopic measurements of suspended and substrate‐supported hBN/MX2/hBN heterostructures with varying laser power and temperature, the out‐of‐plane interfacial thermal conductance in the vertical stack is calibrated. The measured interfacial thermal conductance between MX2and hBN reaches 74 ± 25 MW m−2K−1, which is at least ten times higher than the interfacial thermal conductance of MX2in non‐encapsulation structures. Molecular dynamics (MD) calculations verify and explain the experimental results, suggesting a full encapsulation by hBN layers is accounting for the high interfacial conductance. This ultra‐high interfacial thermal conductance is attributed to the double heat transfer pathways and the clean and tight vdW interface between two crystalline 2D materials. The findings in this study reveal new thermal transport mechanisms in hBN/MX2/hBN structures and shed light on building novel hBN‐encapsulated nanoelectronic devices with enhanced thermal management.

     
    more » « less
  3. Thermal transport across solid interfaces is of great importance for applications like power electronics. In this work, we perform non-equilibrium molecular dynamics simulations to study the effect of light atoms on the thermal transport across SiC/GaN interfaces, where light atoms refer to substitutional or interstitial defect atoms lighter than those in the pristine lattice. Various light atom doping features, such as the light atom concentration, mass of the light atom, and skin depth of the doped region, have been investigated. It is found that substituting Ga atoms in the GaN lattice with lighter atoms ( e.g. boron atoms) with 50% concentration near the interface can increase the thermal boundary conductance (TBC) by up to 50%. If light atoms are introduced interstitially, a similar increase in TBC is observed. Spectral analysis of interfacial heat transfer reveals that the enhanced TBC can be attributed to the stronger coupling of mid- and high-frequency phonons after introducing light atoms. We have also further included quantum correction, which reduces the amount of enhancement, but it still exists. These results may provide a route to improve TBC across solid interfaces as light atoms can be introduced during material growth. 
    more » « less
  4. In standard molecular junctions, a molecular structure is placed between and connected to metal leads. Understanding how mechanical tuning in such molecular junctions can change heat conductance has interesting applications in nanoscale energy transport. In this work, we use nonequilibrium molecular dynamics simulations to address the effect of stretching on the phononic contribution to the heat conduction of molecular junctions consisting of single long-chain alkanes and various metal leads, such as Ag, Au, Cu, Ni, and Pt. The thermal conductance of such junctions is found to be much smaller than the intrinsic thermal conductance of the polymer and significantly depends on the nature of metal leads as expressed by the metal–molecule coupling and metal vibrational density of states. This behavior is expected and reflects the mismatch of phonon spectra at the metal molecule interfaces. As a function of stretching, we find a behavior similar to what was observed earlier [M. Dinpajooh and A. Nitzan, J. Chem. Phys. 153, 164903 (2020)] for pure polymeric structures. At relatively short electrode distances, where the polyethylene chains are compressed, it is found that the thermal conductances of the molecular junctions remain almost constant as one stretches the polymer chains. At critical electrode distances, the thermal conductances start to increase, reaching the values of the fully extended molecular junctions. Similar behaviors are observed for junctions in which several long-chain alkanes are sandwiched between various metal leads. These findings indicate that this behavior under stretching is an intrinsic property of the polymer chain and not significantly associated with the interfacial structures.

     
    more » « less
  5. A number of technological applications and scientific experiments require processes for preparing metal multilayers with electronically and thermally conductive interfaces. We investigate how in situ vs ex situ synthesis processes affect the thermal conductance of metal/metal interfaces. We use time-domain thermoreflectance experiments to study thermal transport in Au/Fe, Al/Cu, and Cu/Pt bilayer samples. We quantify the effect of exposing the bottom metal layer to an ambient environment prior to deposition of the top metal layer. We observe that for Au/Fe, exposure of the Fe layer to air before depositing the top Au layer significantly impedes interfacial electronic currents. Exposing Cu to air prior to depositing an Al layer effectively eliminates interfacial electronic heat currents between the two metal layers. Exposure to air appears to have no effect on interfacial transport in the Cu/Pt system. Finally, we show that a short RF sputter etch of the bottom layer surface is sufficient to ensure a thermally and electronically conductive metal/metal interface in all materials we study. We analyze our results with a two-temperature model and bound the electronic interface conductance for the nine samples we study. Our findings have applications for thin-film synthesis and advance fundamental understanding of electronic thermal conductance at different types of interfaces between metals. 
    more » « less