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1. Schottky contacts to N-polar GaN with SiN interlayer for elevated temperature operation

   https://doi.org/10.1063/5.0083588  

   Khachariya, Dolar ; Szymanski, Dennis ; Reddy, Pramod ; Kohn, Erhard ; Sitar, Zlatko ; Collazo, Ramón ; Pavlidis, Spyridon ( April 2022 , Applied Physics Letters)

   In this Letter, we unveil the high-temperature limits of N-polar GaN Schottky contacts enhanced by a low-pressure chemical vapor deposited (LPCVD) SiN interlayer. Compared to conventional Schottky diodes, the insertion of a 5 nm SiN lossy dielectric interlayer in-between Ni and N-polar GaN increases the turn-on voltage ( V ON ) from 0.4 to 0.9 V and the barrier height ( ϕ B ) from 0.4 to 0.8 eV. This modification also reduces the leakage current at zero bias significantly: at room temperature, the leakage current in the conventional Schottky diode is >10 3 larger than that observed in the device with the SiN interlayer, while at 200 °C, this ratio increases to 10 5 . Thus, the rectification ratio (I ON /I OFF ) at ±1.5 V reduces to less than one at 250 °C for the conventional Schottky diode, whereas for SiN-coated diodes, rectification continues until 500 °C. The I–V characteristics of the diode with an SiN interlayer can be recovered after exposure to 400 °C or lower. Contact degradation occurs at 500 °C, although devices are not destroyed yet. Here, we report N-polar GaN Schottky contact operation up to 500 °C using an LPCVD SiN interlayer. 

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2. Ultra‐High Speed, High‐Sensitivity Spin‐Cast MXene‐Semiconductor‐MXene Photodetectors

   https://doi.org/10.1002/adfm.202206942  

   Montazeri, Kiana ; Currie, Marc ; Barsoum, Michel W. ; Nabet, Bahram ( October 2022 , Advanced Functional Materials)

   A simple room‐temperature process of depositing MXene on a III‐V structure with embedded 2D electron gas (2DEG) is used, which results in a large area, , photodetector (PD) device that greatly outperforms vacuum deposited Ti/Au metal‐semiconductor‐metal (MSM) PD's. By co‐optimizing properties of 2D MXene contacts and the III‐V material heterojunctions, this device sets new operating records with responsivity up to 1.04 A W^‐1at low optical powers, corresponding to >230% internal quantum efficiency, dark current of 50 , >105.6‐dB dynamic range, and 25–150 ps response time, which improves the previous MXene‐Semiconductor‐MXene responsivity by >2.7 times and is 7 × 10³–−10⁶times faster compared to other MXene‐based PDs. This is achieved by enhancing the Schottky barrier height by forming a Van der Waals (vdW) heterojunction between a wide bandgap AlGaAs surface layer and spin coatedTi₃C₂T_zelectrodes. A layered architecture transports the optically generated electrons to a 2DEG channel at the GaAs/AlGaAs heterointerface, where they are rapidly collected. The landscaped electric field pushes the slow holes to an underlying low temperature‐grown GaAs (LT‐GaAs) region where they recombine. The proposed Schottky‐2DEG Photoconductor‐Schottky model for device operation shows how this device circumvents the canonical limitations of gain‐bandwidth product, and carrier transit time, while replacing the need for vacuum deposition of gold or other precious metals.

    

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3. Structural and electrical properties of thick κ -Ga 2 O 3 grown on GaN/sapphire templates

   https://doi.org/10.1063/5.0091653  

   Polyakov, A. Y. ; Nikolaev, V. I. ; Pechnikov, A. I. ; Stepanov, S. I. ; Yakimov, E. B. ; Scheglov, M. P. ; Shchemerov, I. V. ; Vasilev, A. A. ; Kochkova, A. A. ; Chernykh, A. V. ; et al ( June 2022 , APL Materials)

   Thick (23 µm) films of κ-Ga 2 O 3 were grown by Halide Vapor Phase Epitaxy (HVPE) on GaN/sapphire templates at 630 °C. X-ray analysis confirmed the formation of single-phase κ-Ga 2 O 3 with half-widths of the high-resolution x-ray diffraction (004), (006), and (008) symmetric reflections of 4.5 arc min and asymmetric (027) reflection of 14 arc min. Orthorhombic κ-Ga 2 O 3 polymorph formation was confirmed from analysis of the Kikuchi diffraction pattern in electron backscattering diffraction. Secondary electron imaging indicated a reasonably flat surface morphology with a few (area density ∼10 3  cm −2 ) approximately circular (diameter ∼50–100 µm) uncoalesced regions, containing κ-Ga 2 O 3 columns with in-plane dimensions and a height of about 10 µm. Micro-cathodoluminescence (MCL) spectra showed a wide 2–3.5 eV band that could be deconvoluted into narrower bands peaked at 2.59, 2.66, 2.86, and 3.12 eV. Ni Schottky diodes prepared on the films showed good rectification but a high series resistance. The films had a thin near-surface region dominated by E c − 0.7 eV deep centers and a deeper region (∼2 µm from the surface) dominated by shallow donors with concentrations of ≤10 16  cm −3 . Photocurrent and photocapacitance spectra showed the presence of deep compensating acceptors with optical ionization energies of ∼1.35 and 2.3 eV, the latter being close to the energy of one of the MCL bands. Deep level transient spectroscopy revealed deep traps with energies near 0.3, 0.6, 0.7, 0.8, and 1 eV from the conduction band edge. The results show the potential of HVPE to grow very thick κ-Ga 2 O 3 on GaN/sapphire templates. 

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4. Vertical GaN junction barrier Schottky diodes with near-ideal performance using Mg implantation activated by ultra-high-pressure annealing

   https://doi.org/10.35848/1882-0786/ac8f81  

   Khachariya, Dolar ; Stein, Shane ; Mecouch, Will ; Breckenridge, M. Hayden ; Rathkanthiwar, Shashwat ; Mita, Seiji ; Moody, Baxter ; Reddy, Pramod ; Tweedie, James ; Kirste, Ronny ; et al ( September 2022 , Applied Physics Express)

   Abstract We report a kV class, low ON-resistance, vertical GaN junction barrier Schottky (JBS) diode with selective-area p-regions formed via Mg implantation followed by high-temperature, ultra-high pressure (UHP) post-implantation activation anneal. The JBS has an ideality factor of 1.03, a turn-on voltage of 0.75 V, and a specific differential ON-resistance of 0.6 mΩ·cm 2 . The breakdown voltage of the JBS diode is 915 V, corresponding to a maximum electric field of 3.3 MV cm −1 . These results underline that high-performance GaN JBS can be realized using Mg implantation and high-temperature UHP post-activation anneal. 

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5. Effects of Downstream Plasma Exposure on β-Ga 2 O 3 Rectifiers

   https://doi.org/10.1149/2162-8777/ac0500  

   Xia, Xinyi ; Xian, Minghan ; Fares, Chaker ; Ren, Fan ; Kim, Junghun ; Kim, Jihyun ; Tadjer, Marko ; Pearton, Stephen J. ( June 2021 , ECS Journal of Solid State Science and Technology)

   The effects of downstream plasma exposure with O 2 , N 2 or CF 4 discharges on Si-doped Ga 2 O 3 Schottky diode forward and reverse current-voltage characteristics were investigated. The samples were exposed to discharges with rf power of 50 W plasma at a pressure of 400 mTorr and a fixed treatment time of 1 min to simulate dielectric layer removal, photoresist ashing or surface cleaning steps. Schottky contacts were deposited through a shadow mask after exposure to avoid any changes to the surface. A Schottky barrier height of 1.1 eV was obtained for the reference sample without plasma treatment, with an ideality factor of 1.0. The diodes exposed to CF 4 showed a 0.25 V shift from the I–V of the reference sample due to a Schottky barrier height lowering around 14%. The diodes showed a decrease of Schottky barrier height of 2.5 and 6.5% with O 2 or N 2 treatments, respectively. The effect of plasma exposure on the ideality factor of diodes treated with these plasmas was minimal; 0.2% for O 2 and N 2 , 0.3% for CF 4 , respectively. The reverse leakage currents were 1.2, 2.2 and 4.8 μ A cm −2 for the diodes treated with O 2 , and CF 4 , and N 2 respectively. The effect of downstream plasma treatment on diode on-resistance and on-off ratio were also minimal. The changes observed are much less than caused by exposure to hydrogen-containing plasmas and indicate that downstream plasma stripping of films from Ga 2 O 3 during device processing is a relatively benign approach. 

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